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Mems Production, Flip Chip Bonding
Photograph - Photograph
MODEL RELEASED. MEMS production. Clean room technician using flip chip bonding to mount MEMS (microelectromechanical systems) devices. MEMS devices are constructed on a microscopic scale using technologies such as wet and dry etching and thin film deposition. Applications include sensors and optical displays. Materials used to construct MEMS devices include silicon and polymers such as plastics. Photographed at an INEX facility. INEX is a British microsystems and nanotechnology company that was founded in 2002.
May 8th, 2013
Viewed 53 Times - Last Visitor from New York, NY on 12/26/2014 at 7:05 PM
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